Enabling PERK and other MPC-in-the-Head Signatures on Resource-Constrained Devices

Authors

  • Slim Bettaieb Technology Innovation Institute, Abu Dhabi, UAE
  • Loïc Bidoux Technology Innovation Institute, Abu Dhabi, UAE
  • Alessandro Budroni Technology Innovation Institute, Abu Dhabi, UAE
  • Marco Palumbi Technology Innovation Institute, Abu Dhabi, UAE
  • Lucas Pandolfo Perin Technology Innovation Institute, Abu Dhabi, UAE

DOI:

https://doi.org/10.46586/tches.v2024.i4.84-109

Keywords:

Post-Quantum Cryptography, PERK, Stack Usage, Cortex M4

Abstract

One category of the digital signatures submitted to the NIST Post-Quantum Cryptography Standardization Process for Additional Digital Signature Schemes comprises proposals constructed leveraging the MPC-in-the-Head (MPCitH) paradigm. Typically, this framework is characterized by the computation and storage in sequence of large data structures both in signing and verification algorithms, resulting in heavy memory consumption. While some research on the efficiency of these schemes on high-performance machines has been done, studying their performance and optimization on resource-constrained ones still needs to be explored. In this work, we aim to address this gap by (1) introducing a general method to reduce the memory footprint of MPCitH schemes and analyzing its application to several MPCitH proposed schemes in the NIST Standardization Process. Additionally, (2) we conduct a detailed examination of potential memory optimizations in PERK, resulting in a streamlined version of the signing and verification algorithms with a reduced memory footprint ranging from 22 to 85 KB, down from the original 0.3 to 6 MB. Finally, (3) we introduce the first implementation of PERK tailored for Arm Cortex M4 alongside extensive experiments and comparisons against reference implementations.

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Published

2024-09-05

Issue

Section

Articles

How to Cite

Enabling PERK and other MPC-in-the-Head Signatures on Resource-Constrained Devices. (2024). IACR Transactions on Cryptographic Hardware and Embedded Systems, 2024(4), 84-109. https://doi.org/10.46586/tches.v2024.i4.84-109